國家知識產權局信息顯示，化合積電（廈門）半導體科技有限公司取得一項名為“具有散熱和檢測功能的金剛石基體(ti)及金剛石設(she)備”的專利，授(shou)權公告號 CN 222512062 U ，申(shen)請日期為2024年6月。

       專利摘要顯示，本(ben)實用新(xin)型(xing)公開(kai)了一種具有(you)散(san)熱和(he)(he)檢測(ce)功(gong)能的(de)(de)(de)金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)基(ji)(ji)體(ti)(ti)及金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)設(she)備。該金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)基(ji)(ji)體(ti)(ti)包括層(ceng)疊設(she)置(zhi)(zhi)(zhi)的(de)(de)(de)多(duo)個金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)，相(xiang)鄰(lin)兩(liang)個金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)固定結(jie)(jie)(jie)合(he)，多(duo)個金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)包括相(xiang)鄰(lin)設(she)置(zhi)(zhi)(zhi)的(de)(de)(de)第(di)(di)(di)(di)一金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)與(yu)第(di)(di)(di)(di)二(er)金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)以(yi)(yi)及相(xiang)鄰(lin)設(she)置(zhi)(zhi)(zhi)的(de)(de)(de)第(di)(di)(di)(di)三金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)與(yu)第(di)(di)(di)(di)四金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)，第(di)(di)(di)(di)一金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)與(yu)第(di)(di)(di)(di)二(er)金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)之間具有(you)散(san)熱流體(ti)(ti)通道(dao)，金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)基(ji)(ji)體(ti)(ti)上還(huan)設(she)置(zhi)(zhi)(zhi)有(you)與(yu)散(san)熱流體(ti)(ti)通道(dao)連通的(de)(de)(de)介質(zhi)入(ru)口(kou)、介質(zhi)出(chu)口(kou)；第(di)(di)(di)(di)三金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)與(yu)第(di)(di)(di)(di)四金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)之間還(huan)設(she)置(zhi)(zhi)(zhi)有(you)檢測(ce)結(jie)(jie)(jie)構，檢測(ce)結(jie)(jie)(jie)構還(huan)與(yu)第(di)(di)(di)(di)三金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)和(he)(he)/或第(di)(di)(di)(di)四金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)片(pian)(pian)(pian)導熱接觸。本(ben)實用新(xin)型(xing)提高了檢測(ce)結(jie)(jie)(jie)構以(yi)(yi)及金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)基(ji)(ji)體(ti)(ti)的(de)(de)(de)換(huan)熱效率，從而使該金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)基(ji)(ji)體(ti)(ti)可以(yi)(yi)承受(shou)更(geng)(geng)高的(de)(de)(de)功(gong)率，且檢測(ce)精度更(geng)(geng)高，有(you)利于克服直接利用金(jin)(jin)(jin)剛(gang)(gang)石(shi)(shi)(shi)厚膜(mo)帶(dai)來的(de)(de)(de)成本(ben)增加。

       天(tian)眼(yan)查(cha)資料(liao)顯(xian)示，化(hua)合(he)積電（廈(sha)門(men)）半導體科(ke)技有限公(gong)司，成立于2020年，位(wei)于廈(sha)門(men)市，是一(yi)家以從(cong)事研(yan)究和試驗發展為主的企業(ye)(ye)。企業(ye)(ye)注冊資本(ben)1242.2499萬人民(min)幣，實繳資本(ben)516.4418萬人民(min)幣。通過(guo)天(tian)眼(yan)查(cha)大數(shu)據(ju)分析(xi)，化(hua)合(he)積電（廈(sha)門(men)）半導體科(ke)技有限公(gong)司共對外投資了3家企業(ye)(ye)，參與招投標(biao)項目(mu)13次，知識(shi)產權方面有商標(biao)信息(xi)(xi)6條(tiao)，專(zhuan)利信息(xi)(xi)53條(tiao)，此外企業(ye)(ye)還擁有行政許(xu)可8個(ge)。