據國家知識產權局(ju)公(gong)告，青島高測科技股(gu)份有限(xian)公(gong)司申(shen)請(qing)(qing)一項名為“切磨一體機及其控制方(fang)法(fa)、介質、計算機設備“，公(gong)開號CN117754749A，申(shen)請(qing)(qing)日期為2023年9月(yue)。

專利摘要顯示，本發明涉及硬脆材料加工設備技術領域，具體提供了一種切磨一體機、切磨一體機的控制方法、計算機可讀存儲介質、計算機設備，其中的切磨一體機包括剖切組件、磨削組(zu)件(jian)(jian)(jian)(jian)(jian)和上(shang)下料(liao)組(zu)件(jian)(jian)(jian)(jian)(jian)，所(suo)(suo)(suo)述(shu)上(shang)下料(liao)組(zu)件(jian)(jian)(jian)(jian)(jian)包(bao)括(kuo)上(shang)料(liao)組(zu)件(jian)(jian)(jian)(jian)(jian)和下料(liao)組(zu)件(jian)(jian)(jian)(jian)(jian)，所(suo)(suo)(suo)述(shu)控(kong)制(zhi)方法(fa)包(bao)括(kuo)：使(shi)(shi)所(suo)(suo)(suo)述(shu)剖切(qie)(qie)(qie)(qie)組(zu)件(jian)(jian)(jian)(jian)(jian)對待(dai)(dai)(dai)加工(gong)件(jian)(jian)(jian)(jian)(jian)進行剖切(qie)(qie)(qie)(qie)作(zuo)業(ye)；并且/或(huo)者(zhe)使(shi)(shi)所(suo)(suo)(suo)述(shu)磨(mo)(mo)削(xue)(xue)組(zu)件(jian)(jian)(jian)(jian)(jian)對待(dai)(dai)(dai)加工(gong)件(jian)(jian)(jian)(jian)(jian)或(huo)者(zhe)經(jing)所(suo)(suo)(suo)述(shu)剖切(qie)(qie)(qie)(qie)組(zu)件(jian)(jian)(jian)(jian)(jian)剖切(qie)(qie)(qie)(qie)作(zuo)業(ye)后的(de)待(dai)(dai)(dai)加工(gong)件(jian)(jian)(jian)(jian)(jian)進行磨(mo)(mo)削(xue)(xue)作(zuo)業(ye)；使(shi)(shi)所(suo)(suo)(suo)述(shu)上(shang)料(liao)組(zu)件(jian)(jian)(jian)(jian)(jian)將待(dai)(dai)(dai)加工(gong)件(jian)(jian)(jian)(jian)(jian)送達(da)對應(ying)于(yu)所(suo)(suo)(suo)述(shu)剖切(qie)(qie)(qie)(qie)組(zu)件(jian)(jian)(jian)(jian)(jian)和/或(huo)所(suo)(suo)(suo)述(shu)磨(mo)(mo)削(xue)(xue)組(zu)件(jian)(jian)(jian)(jian)(jian)的(de)位置(zhi)；使(shi)(shi)所(suo)(suo)(suo)述(shu)下料(liao)組(zu)件(jian)(jian)(jian)(jian)(jian)將經(jing)剖切(qie)(qie)(qie)(qie)作(zuo)業(ye)和/或(huo)磨(mo)(mo)削(xue)(xue)作(zuo)業(ye)的(de)待(dai)(dai)(dai)加工(gong)件(jian)(jian)(jian)(jian)(jian)移(yi)出所(suo)(suo)(suo)述(shu)切(qie)(qie)(qie)(qie)磨(mo)(mo)一(yi)體機。通過這樣(yang)的(de)構(gou)成，能夠謀求通過切(qie)(qie)(qie)(qie)磨(mo)(mo)一(yi)體機實現針對待(dai)(dai)(dai)加工(gong)件(jian)(jian)(jian)(jian)(jian)的(de)剖切(qie)(qie)(qie)(qie)和磨(mo)(mo)削(xue)(xue)作(zuo)業(ye)。